Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Advanced packages with buried dies

Design support by means of FE analysis and deformation measurement in micro scale
 
: Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.

Society for Microelectronics, Electronic Components and Materials -MIDEM-, Ljubljana:
EMPS 2006 - 4th European Microelectronics and Packaging Symposium with Table-Top Exhibition. Proceedings : May 21 - 24, 2006, Terme Catez, Slovenia
Terme Catez, 2006
ISBN: 961-91023-4-7
European Microelectronics and Packaging Symposium with Table-Top Exhibition (EMPS) <4, 2006, Terme Catez >
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-66242.html