Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Integration technology parameters for physical design of vertical system-in-package
| Institute of Electrical and Electronics Engineers -IEEE-:
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM : May 30 - June 2, 2006, held at Sheraton, San Diego, California
New York, NY: IEEE, 2006
ISBN: 1-4244-0152-6
pp.1392-1400 |
| Electronic Components and Technology Conference (ECTC) <56, 2006, San Diego/Calif> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |