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Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS

 
: Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM : May 30 - June 2, 2006, held at Sheraton, San Diego, California
New York, NY: IEEE, 2006
ISBN: 1-4244-0152-6
Electronic Components and Technology Conference (ECTC) <56, 2006, San Diego/Calif>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-66214.html