English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Details
Full
Export
Statistics
Options
2006
Conference Paper
Titel
Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Author(s)
Dietrich, L.
Toepper, M.
Ehrmann, O.
Reichl, H.
Hauptwerk
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM
Konferenz
Electronic Components and Technology Conference (ECTC) 2006
DOI
10.1109/ECTC.2006.1645783
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM