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In-process monitoring of contact zone forces during rotational grinding of silicon wafers

Monitoring der Kontakzonenkräfte beim Rotationsschleifen von Silicium- Wafern während der Bearbeitung
 
: Pähler, D.; Klocke, F.; Beegen, L.; Herben, M.; Jakob, A.

Zervos, H. ; European Society for Precision Engineering and Nanotechnology -EUSPEN-:
6th International Conference of the European Society for Precision Engineering and Nanotechnology 2006. Proceedings : May 28th - June 1st, 2006, Baden bei Wien, Vienna
Bedford: Euspen, 2006
ISBN: 0-9553082-0-8
ISBN: 978-0-9553082-0-8
pp.68-71
European Society for Precision Engineering and Nanotechnology (International Conference) <6, 2006, Baden bei Wien>
European Society for Precision Engineering and Nanotechnology (Annual General Meeting) <8, 2006, Baden bei Wien>
English
Conference Paper
Fraunhofer IPT ()

Abstract
The basic mechanical interdependencies in rotational grinding of silicon wafers are hardly known. Therefore, a three-component piezoelectric force sensor was integrated into a resin bond D3 cup-grinding wheel segment to analyse the loads in the contact zone. The locally varying force components in the segment's normal, tangential and radial direction were measured with wheel speeds of up to 6000 rpm, allowing for measurements with accelerations of up to 5000 g. The radial forces were found to be of no significant magnitude, while normal and tangential forces proved to be substantial and of the same order.process characterizing parameters such as forces and temperatures. Future work must investigate the influence of crystal orientation onto the process forces.

: http://publica.fraunhofer.de/documents/N-65128.html