• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Artikel
  4. Fabrication of application specific integrated passive devices using wafer level packaging technologies
 
  • Details
  • Full
Options
2007
Journal Article
Title

Fabrication of application specific integrated passive devices using wafer level packaging technologies

Abstract
Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of integrated passive components. In this context, particularly the fabrication of integrated passive devices (IPDs) represents a promising solution regarding the reduction of size and assembly costs of electronic systems in package (SiP). IPDs combine different passive components (R, L, C) in one subcomponent to be assembled in one step by standard technologies like surface mount device (SMD) or flip chip. In this paper, the wafer level thin film fabrication of integrated passive devices (WL-IPDs) will be discussed. After a brief overview of the different possibilities for the realization of IPDs using wafer level packaging technologies two fabricated WL-IPDs will be presented. Design, technological realization, as well as results from the electrical characterization will be discussed.
Author(s)
Zoschke, K.
Wolf, M.J.
Töpper, M.
Ehrmann, O.
Fritzsch, T.
Kaletta, K.
Schmückle, F.J.
Reichl, H.
Journal
IEEE transactions on advanced packaging  
DOI
10.1109/TADVP.2007.901770
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024