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2021
Conference Paper
Titel
Tubular electronics - Next step in system integration
Abstract
Most kinds of electronic systems start on a PCB or a ceramic board. But not all kind of applications can be fulfilled with such plane substrates. Many kinds of heaters or sensors prefer a tubular shape to increase the integration level or signal quality. Therefore, the Fraunhofer IKTS is developing technologies to transfer planar layouts on tubular surface since over 20 years. Main working fields are screen printed designs on ceramic or metallic surfaces. Different application examples will be given to discuss possibilities and advantages of this technology. The work provided food for thought for useful next component generations.