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Development of a highly adaptable method for structural integrity assessment by means of a removable piezoelectric measurement head for electromechanical impedance determination

: Park, Y.J.; Asins, C.C.; Laveuve, D.; Brandt, M.; Rieß, S.; Gerhardt, M.

Desmet, W. ; Katholieke Universiteit Leuven, Departement Werktuigkunde:
ISMA 2020, International Conference on Noise and Vibration Engineering. Proceedings : In conjunction with the 8th International Conference on Uncertainty in Structural Dynamics (USD2020), 7 to 9 September 2020, CD-ROM, virtually
Leuven: KU Leuven, 2020
ISBN: 978-90-828931-1-3
International Conference on Noise and Vibration Engineering <29, 2020, Online>
International Conference on Uncertainty in Structural Dynamics (USD) <8, 2020, Online>
Conference Paper
Fraunhofer LBF ()

Ensuring integrity and mechanical performance of composite structures often requires careful quality control especially regarding joints and assembly processes. One promising technology for non-destructive Inspection in these cases is electromechanical impedance measurement. However, in the conventional manner of electromechanical impedance (EMI) measurement, a piezoelectric transducer is permanently attached to the test structure by using a structural adhesive. In these cases, the structural adhesive is indispensable to obtain electromechanical coupling between the piezoelectric transducer and the test structure. On the other hand, it constitutes one of the main drawbacks of EMI-measurement method due to the fact, that it is only removable with high chemical or mechanical effort. In this article, different approaches are tested to achieve electromechanical coupling without using a structural adhesive and realize an applicable measurement head setup for the piezoelectri c transducer to perform EMI measurements.