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Experimental study of panel level packaging warpage

 
: Ecoiffier, D.; Vernhes, P.; Ooi, R.C.; Braun, T.; Dreissigacker, M.; Fu, H.

:

Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. Proceedings : September 15th to 18th, 2020, Vestfold, Norway
Piscataway, NJ: IEEE, 2020
ISBN: 978-1-7281-6293-5
ISBN: 978-1-7281-6294-2
ISBN: 978-1-7281-6292-8
pp.634-637
Electronics System-Integration Technology Conference (ESTC) <8, 2020, Online>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper presents an analysis on panel warpage as the growth of the panel exceeds beyond current wafer sizes. This work is a part of iNemi working group "Wafer/Panel Level Package Flowability and Warpage Project". The aim of the project is to understand material, process and design factors that impact on flowability and warpage. This paper focuses on warpage measurement aspect: method and results.

: http://publica.fraunhofer.de/documents/N-639397.html