Failure mechanism detection algorithm with MOSFET body diode

Autonomous driving is playing a big role in the automotive industry and defines the future of mobility on a big scale. However, autonomous driving faces several challenges, such as the performance of artificial intelligence and hardware reliability. To ensure safe functionality, the reliability of the electronic components plays an essential role and must be taken into consideration. One aspect of studies that analyze the electronics reliability is the observation of the system's thermal impedance and deriving a correlation between the failure mechanisms and thermal impedance behavior. In recent times, several new approaches have been suggested to improve the electronics reliability. Many studies were carried out to determine the effect of solder voiding on the thermal impedance of chip-level packages. In this paper, a defect diagnosis and physical damage detection method for electronic packaging are studied by measuring the thermal impedance through the body diode of the device under test (DUT). The detection method uses MOSFET body diode temperature measurements to investigate different failure mechanisms at different locations in the electronic packaging system.