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2019
Conference Paper
Titel
Actively aligned flip-chip integration of InP to sin utilizing optical backscatter reflectometry
Abstract
We present our hybrid III-V/SiN integration interface with a novel active alignment technique overcoming contacting limitations in flip-chip assembly. The interface allows for integration of single chips and full arrays. An average coupling loss of −2.1dB and a record coupled power exceeding 60mW is achieved.