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Requirements and potentialities of packaging for bioreactors with LTCC and polymer

: Klotzbach, U.; Franke, V.; Sonntag, F.; Morgenthal, L.; Beyer, E.


Pfleging, W. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based micro- and nanopackaging and assembly : 22 - 24 January 2007, San Jose, California, USA
Bellingham, WA: SPIE, 2007 (SPIE Proceedings Series 6459)
ISBN: 978-0-8194-6572-6
Paper 645902
Conference "Laser-Based Micro- and Nanopackaging and Assembly" <2007, San Jose/Calif.>
Conference Paper
Fraunhofer IWS ()

The main focus of this article lies on the development of a novel joining technology for LTCC ceramic and polymer sub-assemblies utilising laser radiation. Technical processes and the latest results are presented as well as potential future applications. The developed joining process can be divided into two steps utilizing the same laser system: a surface modification of the joining partners and a thermal process that is melting a small portion of the polymer matrix that is being pressed into the roughness of the ceramic surface.