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Quality control of ultra-microelectrode arrays using cyclic voltammetry, electrochemical impedance spectroscopy and scanning electrochemical microscopy

: Köster, O.; Schuhmann, W.; Vogt, H.; Mokwa, W.


Sensors and Actuators. B 76 (2001), No.1-3, pp.573-581
ISSN: 0925-4005
International Meeting on Chemical Sensors (IMCS) <8, 2000, Basel>
Conference Paper, Journal Article
Fraunhofer IMS ()
ultramicroelectrode-array; cyclic voltammetry; electrochemical impedance spectroscopy; scanning electron microscopy; thin-film transducer; Abtastung; array; Scheinwiderstand; Voltammetrie

Miniaturised amperometric transducers have been realised on silicon wafers integrating a disk ultra-microelectrode array as working electrodes, a large counter electrode and a Ag/AgCl pseudo reference electrode in a three-electrode configuration. Cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS) and scanning electrochemical microscopy (SECM) have been evaluated as tools for rapid on-wafer determination of characteristic device parameters. Here, we report on the application of an automated wafer prober in combination with appropriate electroanalytical techniques to realise an automated quality control of UMA on wafer level.