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2020
Conference Paper
Titel
A simulation of the capability of multispectral infrared imaging for thermographic inspection of multi-material systems
Abstract
The usage of multi-material systems is increasing just as the customization of industrial products right inside the fabrication process. As different materials and surfaces have a very characteristic interaction with infrared radiation, implications for the usability of thermography for quality control or monitoring setups are substantial. Multispectral imaging approaches are promising to overcome the constraints of an uncertain or unknown emissivity coefficient. A simulation is presented that can illustrate their capability and emphasize their value for non-destructive testing and monitoring.
Author(s)