
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Condition monitoring for the Binder Jetting AM-process with machine learning approaches
| Institute of Electrical and Electronics Engineers -IEEE-; IEEE Industrial Electronics Society -IES-: IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020. Proceedings : Online Conference; Tampere, Finland, 10 - 12 June 2020 Piscataway, NJ: IEEE, 2020 ISBN: 978-1-7281-6389-5 ISBN: 978-1-7281-6390-1 pp.417-420 |
| Conference on Industrial Cyberphysical Systems (ICPS) <2020, Online> |
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| English |
| Conference Paper |
| Fraunhofer IGCV () |
| Zustandsüberwachung; Bildanalyse; Binder-Jetting |
Abstract
Binder jetting is an additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.