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MEMS compatible illumination and imaging micro-optical systems

 
: Bräuer, A.; Dannberg, P.; Duparre, J.; Höfer, B.; Schreiber, P.; Scholles, M.

:

Dickensheets, D.L. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
MOEMS and miniaturized systems VI : 24 - 25 January 2007, San Jose, California, USA
Bellingham, WA: SPIE, 2007 (SPIE Proceedings Series 6466)
ISBN: 978-0-8194-6579-5
Paper 646608
Conference "MOEMS and Miniaturized Systems" <6, 2007, San Jose/Calif.>
English
Conference Paper
Fraunhofer IOF ()
Fraunhofer IPMS ()
microlens technology; MEMS and microoptic; insect eye CMOS camera; laser scanning projector

Abstract
The development of new MOEMS demands for cooperation between researchers in micromechanics, optoelectronics and microoptics at a very early state. Additionally, microoptical technologies being compatible with structured silicon have to be developed. The microoptical technologies used for two silicon based microsystems are described in the paper. First, a very small scanning laser projector with a volume of less than 2 cm3, which operates with a directly modulated lasers collimated with a microlens, is shown.
The laser radiation illuminates a 2D-MEMS scanning mirror. The optical design is optimized for high resolution (VGA). Thermomechanical stability is realized by design and using a structured ceramics motherboard. Secondly, an ultrathin CMOS-camera having an insect inspired imaging system has been realized. It is the first experimental realization of an artificial compound eye. Micro-optical design principles and technology is used. The overall thickness of the imaging system is only 320 µm, the diagonal field of view is 21°, and the f-number is 2.6.
The monolithic device consists of an UV-replicated microlens array upon a thin silica substrate with a pinhole array in a metal layer on the back side. The pitch of the pinholes differs from that of the lens array to provide individual viewing angle for each channel. The imaging chip is directly glued to a CMOS sensor with adapted pitch. The whole camera is less than 1mm thick. New packaging methods for these systems are under development.

: http://publica.fraunhofer.de/documents/N-61634.html