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Development of Temperature Resistant Joints - Testing and Influences

 
: Nowottnick, M.; Scheel, W.; Wittke, K.; Pape, U.; Schulz, J.

Mach, P.; Urbanek, J.:
European Microelectronics Packaging and Interconnection Symposium 2000. Proceedings
Prag: IMAPS, Czech and Slovak Chapter, 2000
ISBN: 80-238-5509-3
pp.78-83
European Microelectronics Packaging and Interconnection Symposium <2000, Prag>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-6156.html