• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling
 
  • Details
  • Full
Options
2020
Conference Paper
Title

Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling

Abstract
Glass integrated single-mode waveguides were fabricated by ion-exchange in large panel-size low-cost display glass. Propagation losses of 0.059 dB/cm (at 1550 nm) were achieved and a high process homogeneity across a panel was shown by comparison of 25 waveguides. For the first time, 12 spiral-shaped single-mode waveguides with a length of more than 2 meter were integrated in glass. Furthermore, in-plane evanescent field coupling tests were conducted to achieve first optical functions on large sized glass. To achieve higher integration density and more flexible routing, this work presents a layout-based approach to reduce bend radii without increasing propagation losses. Also without changing process parameters, selectively buried waveguides were manufactured to enable localized areas for out-of-plane coupling from EOCB to flip-chip PIC. These results provide a basis for a novel coupling concept - gradient index surface coupling (GISC).
Author(s)
Schwietering, J.
Herbst, C.
Kirsch, O.
Arndt-Staufenbiel, N.
Wachholz, P.
Schröder, H.
Schneider-Ramelow, M.
Mainwork
IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Proceedings  
Conference
Electronic Components and Technology Conference (ECTC) 2020  
DOI
10.1109/ECTC32862.2020.00036
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024