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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Study on reflowable underfill materials for different flip chip processes

 
: Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H.

Electronic Components, Assemblies, and Materials Association; IEEE Components, Packaging, and Manufacturing Technology Society:
ECTC 2000. Proceedings of the 50th Electronic Components & Technology Conference : May 21 - 24, 2000, Las Vegas, Nevada, USA
Piscataway, NJ, USA: IEEE Press, 2000
ISBN: 0-7803-5908-9
ISBN: 0-7803-5909-7
ISBN: 0-7803-5910-0
ISBN: 0-7803-5911-9
Electronic Components and Technology Conference (ECTC) <50, 2000, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-6144.html