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Concepts for ultra thin packaging technologies

 
: Aschenbrenner, R.; Ansorge, F.; Feil, M.; Landesberger, C.; Jung, E.; Ostmann, A.; Reichl, H.

:

Kivilahti, J.; Hyytiaeinen, M. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Adhesives in Electronics 2000. 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing : Espoo, Finland, June 18 - 21, 2000
New York, NY: IEEE, 2000
ISBN: 0-7803-6460-0
pp.16-19
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing <4, 2000, Helsinki>
English
Conference Paper
Fraunhofer IZM ()

Abstract
As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.

: http://publica.fraunhofer.de/documents/N-6142.html