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Reliability of flip chip and chip size packages

 
: Reichl, H.; Schubert, A.; Töpper, M.

:

Balk, L.J.:
Reliability of electron devices, failure physics and analysis : Proceedings of the 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis. 2-6 October 2000, Dresden, Germany
Oxford: Pergamon, 2000 (Microelectronics reliability 40, 8/10 : Special issue)
pp.1243-1254
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <11, 2000, Dresden>
English
Conference Paper, Journal Article
Fraunhofer IZM ()

Abstract
Reliability and functionality of microelectronics products utilizing advanced packaging approaches, i.e. flip chip interconnection technology, chip scale or wafer level packaging, largely depend on their mechanical and thermal constitution. Thermo-mechanical aspects of component and system reliability become more and more important with growing miniaturization as the local physical parameters and field quantities show an increase in sensitivity due to inhomogeneities in local stresses, strains and temperature fields. Since there is usually a lack of information about the local material parameters, a pure field simulation cannot, as a rule, solve the problem. The state of the art of electronic packaging design more and more requires direct "acoupling" between simulation tools (including e.g. FE modeling) and advanced physical experiments.

: http://publica.fraunhofer.de/documents/N-6131.html