Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Introducing a Reference Flow for Chip-Package Co-Design for 5G / MM-Wave Designs on GF ADK for 22FDX
Presentation held at Cadence Live Europe 2020, Virtual Event, October 13-14, 2020
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presentation urn:nbn:de:0011-n-6060973 (1.7 MByte PDF) MD5 Fingerprint: 554a9bb6b90149b9ee15cdbc0db2a7df Created on: 4.11.2020 |
| 2020, 21 Folien
Event "CadenceLIVE" <2020, Online> |
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| English |
| Presentation, Electronic Publication |
| Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) () |
Abstract
This talk is presenting a reference flow for a chip-package co-design. The technology used, is a 22FDx IC-technology combined with a two-level package technology. The application case is data transfer at 60GHz for 5G. To cope with the requirements of such a system an Assembly Design Kit (ADK) is necessary to enable co-design.