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Analysis of CMOS Metallization Trenches using Angle-Resolved XPS

Poster presented at 18th European Conference on Applications of Surface and Interface Analysis, ECASIA 2019, September 15 - 20, 2019, Dresden, Germany

: Wehring, Bettina; Gerlich, Lukas; Wislicenus, Marcus

	2019, 1 Folie European Conference on Applications of Surface and Interface Analysis (ECASIA) <18, 2019, Dresden>

	English
	Poster
	Fraunhofer IPMS ()
	Anfrage beim Institut / Available on request from the institute bibliothek@ipms.fraunhofer.de

: http://publica.fraunhofer.de/documents/N-603175.html