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3D hot-spot localization by lock-in thermography
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2020
Journal Article
Titel
3D hot-spot localization by lock-in thermography
Author(s)
Brand, S.
Altmann, F.
Zeitschrift
Electronic device failure analysis : EDFAS
Language
English
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Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS