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Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser

: Fleischer, A.S.; Troppenz, U.; Hamacher, M.; John, W.


Microelectronics reliability 46 (2006), No.2-4, pp.421-431
ISSN: 0026-2714
Journal Article
Fraunhofer IZM ()

The vertical coupling of active InP based ring resonators and passive feeding waveguides necessitates the use of a waferbonding technology in the fabrication process. The required bond material (BCB) has a low thermal conductivity and will strongly influence the operating temperature and thus the performance of the ring resonator through its insulating effect. A comprehensive thermal analysis of a proposed vertically coupled ring resonator of 50 µm outer radius is undertaken during the design phase to determine the thermal impact of: the design of the wafer bond, the design of the passivation layer and the optical power levels. Thermal abatement strategies for semiconductor lasers are presented.