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Design, test, integration and packaging of MEMS/MOEMS, 2005

 
: Courtois, B.; Michel, B.

:

Courtois, B.:
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2005. Special issue : Montreux-Switzerland, 01-03 June 2005
Berlin: Springer, 2006 (Microsystem technologies 12.2006, Nr.10/11)
pp.891
Symposium of Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2005, Montreux>
English
Conference Paper, Journal Article
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-59747.html