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Imprinting the polytype structure of silicon carbide by rapid thermal processing

: Pezoldt, Jörgen; Cimalla, Volker

Fulltext urn:nbn:de:0011-n-5970591 (2.5 MByte PDF)
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Created on: 5.8.2020

Crystals 10 (2020), No.6, Art. 523, 21 pp.
ISSN: 2073-4352
Journal Article, Electronic Publication
Fraunhofer IAF ()
silicon carbide; rapid thermal processing; ion-implemantation; epitaxy; CVD; sublimation; polytypism; phase transition; polytype transition; polytype control

Silicon carbide is a material with a multistable crystallographic structure, i.e., a polytypic material. Different polytypes exhibit different band gaps and electronic properties with nearly identical basal plane lattice constants, making them interesting for heterostructures without concentration gradients. The controlled formation of this heterostructure is still a challenge. The ability to adjust a defined temperature–time profile using rapid thermal processing was used to imprint the polytype transitions by controlling the nucleation and structural evolution during the temperature ramp-upand the steady state. The influence of the linear heating-up rate velocity during ramp-up and steady-state temperature on the crystal structure of amorphized ion-implanted silicon carbide layers was studied and used to form heteropolytype structures. Integrating the structural selection properties of the non-isothermal annealing stage of the ion-implanted layers into an epitaxial growth process allows the imprinting of polytype patterns in epitaxial layers due to the structural replication of the polytype pattern during epitaxial growth. The developed methodology paves the way for structural selection and vertical and lateral polytype patterning. In rapid thermal chemical vapor deposition, the adjustment of the process parameters or the buffer layer allowed the nucleation and growth of wurtzite silicon carbide.