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Enabling low-cost high-volume production compatible terabit transceivers with up to 1.6 Tbps capacity and 100Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2km: The TERIPHIC project approach

 
: Groumas, P.; Tsokos, C.; Felipe, D.; Troppenz, U.; Hersent, R.; Bakopoulos, P.; Atias, B.; Dupuy, J.Y.; Pagano, A.; Chiado Piat, A.; Kibben, S.; Gounaridis, L.; Raptakis, A.; Seyfried, M.; Moehrle, M.; Kouloumentas, C.; Keil, N.; Avramopoulos, H.

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Srivastava, A.K. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Metro and Data Center Optical Networks and Short-Reach Links III : 5-6 February 2020, San Francisco, California
Bellingham, WA: SPIE, 2020 (Proceedings of SPIE 11308)
ISBN: 978-1-5106-3379-7
ISBN: 978-1-5106-3380-3
Paper 113080C, 14 pp.
Conference "Metro and Data Center Optical Networks and Short-Reach Links" <3, 2020, San Francisco/Calif.>
English
Conference Paper
Fraunhofer HHI ()

Abstract
Existing transceiver technology inside data centers will soon reach its limits due to the enormous traffic growth rates driven by new, bandwidth-hungry applications. Efforts to develop the next generation of 800Gbps and 1.6Tbps transceivers for intra-DC optical interconnects have already kicked-off to address the demands in traffic, the exhaustion of the ports at the digital switches and the power consumption limitations inherent to the use of many lower capacity modules. The new generation of optical modules must also provide Terabit capacities at low cost, necessitating the use of high-volume manufacturing processes. TERIPHIC is an EU funded R and D project that aims at developing transceiver modules with up to 1.6 Tbps capacity over 16 lanes in duplex fiber and cost less than 1 € per Gbps for distances up to 2 km, utilizing PAM-4 modulation for 100Gbps per lane and high-volume production compatible transceiver designs. At the component level, TERIPHIC will rely on arrays of high-speed electronics, InP Externally Modulated Lasers (EMLs) and InP photodetectors, and at the integration level it will rely on a polymer photonic platform as a host motherboard, leveraging its flexibility and powerful toolbox. A summary of the progress on the TERIPHIC transceiver modules concept, both at the component level and integration level is presented in this paper.

: http://publica.fraunhofer.de/documents/N-596257.html