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Numerical approach to characterization of thermally conductive adhesives

: Falat, T.; Wymyslowski, A.; Kolbe, J.


Microelectronics reliability 47 (2007), No.2-3, pp.342-346
ISSN: 0026-2714
Journal Article
Fraunhofer IFAM ()

Thermally conductive adhesives belong to polymer materials. In order to apply numerical simulation it is required to have an appropriate description of the thermal and mechanical behavior of polymers. Most often polymers are described by cure dependent or independent linear viscoelastic model. Having this model, which's parameters in fact can be measured experimentally, it is possible to simulate the stress and strain field caused by polymer curing and shrinkage phenomena and finally assess the thermal conductance accordingly. This approach was implemented in this paper.