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From turning to grinding: Ductile machining with gPVA

: Vogt, C.; Fähnle, O.; Rascher, R.; Doetz, M.; Dambon, O.; Klocke, F.


Williamson, R. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical Manufacturing and Testing XII : 20-22 August 2018, San Diego, California, United States
Bellingham, WA: SPIE, 2018 (Proceedings of SPIE 10742)
ISBN: 978-1-5106-2055-1
ISBN: 978-1-5106-2056-8
Paper 107420I, 7 pp.
Conference "Optical Manufacturing and Testing" <12, 2018, San Diego/Calif.>
Conference Paper
Fraunhofer IPT ()

Grinding processes are usually set up experimentally, product-specifically and iteratively. The selected parameters are often based on empirical values, whereby the user can set very different parameters and achieve similar results.
In 2017, the so called “grinding process validation approach” (gPVA) was introduced to determine suitable parameter windows. The method allows the definition of parameter windows for grinding tools and materials. Parameter adjustments for optimum results are possible due to the experimentally determined dependence on specific chip volume and tool pressure.
The system was originally developed to describe brittle grinding processes on standard grinding machines. Tests on an ultra-precision lathe provide process parameter data on ductile mode machining of tungsten carbide using UPM machines. This paper reports on gPVA being applied to transfer the ductile machining process from UPM machineries to a standard CNC grinding machine.