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Millimeter-Wave Propagation within a Computer Chip Package

: Timoneda, X.; Abadal, S.; Cabellos-Aparicio, A.; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Symposium on Circuits and Systems, ISCAS 2018. Proceedings : 27-30 May 2018, Florence, Italy
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-4881-0
ISBN: 978-1-5386-4882-7
International Symposium on Circuits and Systems (ISCAS) <2018, Florence>
Conference Paper
Fraunhofer IZM ()

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).