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Ceramic Embedding as Packaging Solution for Future Power Electronic Applications

: Bach, H.L.; Endres, T.M.; Dirksen, D.; Zischler, S.; Bayer, C.F.; Schletz, A.; März, M.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Industry Applications Society:
International Power Electronics Conference, IPEC-Niigata 2018 - ECCE Asia : May 20-24, 2018, Niigata, Japan
Piscataway, NJ: IEEE, 2018
ISBN: 978-4-88686-405-5
ISBN: 978-4-88686-403-1
ISBN: 978-1-5386-4190-3
International Power Electronics Conference (IPEC) <2018, Niigata>
Conference Paper
Fraunhofer IISB ()

This paper proposes a novel packaging concept for power electronic applications on basis of embedding power devices in ceramic circuit carriers, such as direct bonded copper (DBC) substrates. The semiconductor devices are assembled into laser structured DBC substrates and then sealed with a copper cover afterwards. This proposed method is an alternative solution to printed circuit board (PCB) embedding and low-temperature co-fired ceramic (LTCC) based multilayer technologies, which are insufficient for high power applications due to the limited temperature resistance and current carrying capacity. The feasibility study confirmed that the DBC embedding approach was successfully implemented by using laser technology combined with conductive gluing, solder, and silver sintering processes.