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Ag sintering - An alternative large area joining technology

: Weber, C.; Hutter, M.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
8 pp.
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Conference Paper
Fraunhofer IZM ()

Ag sintering as interconnection technology for first level interconnects has made its way to production. For example, in order to join power semiconductors or LEDs. But what about extending the application field to use this technology for large area joining. For instance, replacing thermal grease by a sintered Ag joint between a power module and a baseplate. In order to evaluate if it is feasible to generate a sintered Ag joint of 900 mm 2 tests were conducted by mounting Cu sheets on AlMg3 sheets by pressureless and pressure assisted Ag sintering. The reliability of such large area interconnects was tested by thermal cycling between -55 °C and +125 °C.