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Corrosion mechanism in metallization systems for printed circuit boards

: Klengel, S.; Stephan, T.; Mühs-Portius, B.; Klengel, R.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Conference Paper
Fraunhofer IMWS ()

This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.