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Microstructural and chemical investigation of dielectric breakdown areas in engineering plastics

 
: Bernhardt, R.; Böttge, B.; Klengel, S.; Bron, M.; Wels, S.; Claudi, A.

:

TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
pp.429-436
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
English
Conference Paper
Fraunhofer IMWS ()

Abstract
The study investigates the electrical strength of three commercially available engineering plastics by using two different measurement setups. For this purpose, a test approach based on a novel test specimen design was evaluated in comparison to the standard test setup according to DIN EN 60243-1. The limitations and advantages of both methods will be discussed. Furthermore, the results of electrical strength testing show that the fiber orientation and the ionic content influence the breakdown performance and the formation of the breakdown path of engineering plastics.

: http://publica.fraunhofer.de/documents/N-581478.html