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Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix

: Wunderle, B.; May, D.; Ras, M.A.; Grosse, C.; Wöhrmann, M.; Bader, V.; Keller, J.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Conference Paper
Fraunhofer IZM ()

We have developed a novel, rapid, robust and non- destructive experimental technique for in-situ monitoring of delamination of interfaces for electronic packages. The method is based on a simple thermal transducer matrix of so-called THIXELS (thermal pixels) which allows a spatially resolved real- time image of the current status of delamination as from a proximity camera. The transducers are small metal wire meanders which are electrically driven and read out using the well-known 3-omega method. This method has special advantages over other thermal contrast methods with respect to robustness, sensitivity and signal-to-noise ratio. Notable is the absence of cross-effects. The proof of concept has been furnished on an industry-grade flip-chip package with underfill on an organic substrate with in-situ and real-time remote readout capability, showing CCD look & feel in delamination testing. The technique is especially powerful for buried interfaces, where time-honoured methods like scanning acoustic microscopy (SAM) cannot be applied.