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Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects

: Meyer, J.; Upasani, P.J.; Bickel, S.; Panchenko, I.; Wolf, M.J.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Conference Paper
Fraunhofer IZM ()

Nanoporous intermetallic compounds (IMCs) are a promising option for interconnects in 3D integration of various electronic components. These combine the high thermal and mechanical stability of Cu-Sn-SLID (solid-liquid interdiffusion) interconnects with a strongly reduced processing time. In this paper we address the influence of the flux on the nanostructure of the interconnects. The further dissolution of Sn from the already known lamellar network of Cu 3 Sn is reported for the first time and analyzed in detail.