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  4. Numerical Simulation of an Ozone-Based Wet-Chemical Etching
 
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2019
Conference Paper
Title

Numerical Simulation of an Ozone-Based Wet-Chemical Etching

Abstract
In the PV-industry, wet-chemical baths are used for surface structuring, conditioning and cleaning. Besides cleaning the wafers, ozone-based wet-chemical cleaning processes show the ancillary effect of intendedly etching back the emitter and/or rounding of textured surfaces. To simulate and predict this rounding of micro-pyramids during the cleaning process, a two dimensional process simulation model was built. With the finite element method of COMSOL Multiphysics the diffusion and convection based mass transport of ozone along the pyramids is described. Important parameters for the evaluation, obtained from experimental results, are the etch rate and resulting roundness (R) of the micro-pyramids tips. A parametric study was carried out with the purpose of adjusting the model. The simulation represents the experimental data accurately, e.g. after 2 min exposure time R = 67 nm for the experimental and R = 66 nm for the simulation data.
Author(s)
Mohr, Lena
Krick, T.
Zimmer, Martin  
Fischer, Andreas  
Moldovan, Anamaria  
Mainwork
SiliconPV 2019, the 9th International Conference on Crystalline Silicon Photovoltaics  
Conference
International Conference on Crystalline Silicon Photovoltaics (SiliconPV) 2019  
File(s)
Download (524.11 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-r-406899
10.1063/1.5123856
Language
English
Fraunhofer-Institut für Solare Energiesysteme ISE  
Keyword(s)
  • Photovoltaik

  • Silicium-Photovoltaik

  • Oberflächen: Konditionierung

  • Passivierung

  • Lichteinfang

  • fluid dynamics

  • etching

  • cleaning

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