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  4. A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants
 
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2019
Conference Paper
Title

A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants

Abstract
One key obstacle in employing silicon integrated circuits in flexible implants is ensuring a long-term operation of the chip within the wet corrosive environment of the body. For this reason, throughout the years, various biocompatible insulating materials have been proposed, yet, evaluating their long-term encapsulation performance on representative silicon samples still remains to be the main challenge. For this aim, in this work, a sensitive platform is introduced that can track the integrity of the chip against water and ion ingress. This platform is developed to be used for long-term monitoring of chip integrity and study of encapsulation layers in wet environments. The platform comprises a sensing array and a measurement engine and operates by tracking the changes in the inter-layer dielectric resistance within the chip. The proposed system uses a novel charge/discharge-based time-mode resistance sensor that can be implemented using simple yet highly robust circuitry. The sensor array is implemented together with the measurement engine in a standard 0.18 µm 6-metal CMOS process. For chip validation, dry and wet measurements in saline are presented in this paper.
Author(s)
Akgun, Omer Can
Nanbakhsh, Kambiz
Giagka, Vasiliki  
Serdijn, Wouter A.
Mainwork
IEEE Biomedical Circuits and Systems Conference, BioCAS 2019. Conference Proceedings  
Conference
Biomedical Circuits and Systems Conference (BioCAS) 2019  
Open Access
DOI
10.1109/BIOCAS.2019.8919203
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