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Optical inspection of noncooperative copper surface structures using multi- and hyperspectral acquisition systems

: Wrieden, M.; Breitbarth, A.; Zimmermann, M.; Schambach, J.; Rosenberger, M.; Notni, G.


Beyerer, J. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Automated Visual Inspection and Machine Vision III : 27 June 2019, Munich, Germany
Bellingham, WA: SPIE, 2019 (Proceedings of SPIE 11061)
ISBN: 978-1-5106-2801-4
ISBN: 978-1-5106-2802-1
Paper 1106106, 11 pp.
Conference "Automated Visual Inspection and Machine Vision" <3, 2019, Munich>
World of Photonics Congress <2019, Munich>
Conference Paper
Fraunhofer IOF ()

In order to enhance the efficiency of quality inspection of Direct Copper Bonded (DCB) structures an optical inspection using a 3D measuring system is conceivable. However, it is a challenging task to use 3D optical measurement techniques for diffuse reflective copper surfaces. This work deals with the optical detection of defects of the copper surface, using multi-and hyperspectral acquisition devices. Over a broad spectral range from the visual spectrum to the short-wave infrared (400 nm-1700 nm) it is analysed which wavelengths provide good contrast ratios for the detection of flaws. For the inspection of the sample back side, the push-broom imager, operating in the VIS and NIR range (400 nm-1000 nm), provides the best contrast ratio. An outstanding contrast is reached around 400 nm. Deposited particles on the front side of the DCB substrates are best detected by the filter wheel camera, which is sensitive in the visual and near infrared range. Outstanding contrast is reached with wavelengths around 640 nm. After evaluating the standard deviations of the gray values, it can be shown that defects differ clearly from flawless substrate areas under investigation with light of wavelengths 577 nm, 640 nm and 950 nm. Furthermore, the comparison between certain pixel spectra confirms that significant differences appear at the same three wavelengths. Regarding an automated inspection of defects, it is advisable to shift the pattern projection for the 3D correspondence analysis to the spectral ranges mentioned.