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Mobile Handheld FMCW Terahertz Multilayer Thickness Inspection

: Schreiner, Nina S.; Weber, Stefan; Keil, Andreas; Friederich, Fabian


Institute of Electrical and Electronics Engineers -IEEE-:
44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019 : 1-6 September 2019, Paris, France
Piscataway, NJ: IEEE, 2019
ISBN: 978-1-5386-8285-2
ISBN: 978-1-5386-8286-9
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) <44, 2019, Paris>
Conference Paper
Fraunhofer ITWM ()
mobile handheld FMCW terahertz multilayer thickness inspection; all-electronic handheld system; thickness determination; dielectric multilayer structures; frequency-modulated continuous-wave terahertz transceiver; integrated linear position encoder; B-scan images; frequency modulation bandwidth

We present an all-electronic handheld system for the thickness determination of dielectric multilayer structures with submillimeter to several centimeter layer thicknesses, using a frequency-modulated continuous-wave terahertz transceiver. Besides A-scans, an integrated linear position encoder allows to obtain B-scan images. In order to resolve layers below the inherent resolution limit given by the frequency modulation bandwidth, we take advantage of model-based signal processing techniques.