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3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring

 
: Köck, A.; Wimmer-Teubenbacher, R.; Sosada-Ludwikovska, F.; Rohracher, K.; Wachmann, E.; Herold, M.; Welden, T. an; Kim, J.M.; Ali, Z.; Poenninger, A.; Stahl-Offergeld, M.; Hohe, H.-P.; Lorenz, J.; Erlbacher, T.; Dolmans, G.; Offermans, P.; Vandecasteele, M.; Yurchenko, O.; Sicard, O. von; Pohle, R.; Udrea, F.; Falco, C.; Flandre, D.; Bol, D.; Comini, E.; Zappa, D.; Gardner, J.; Cole, M.; Theunis, J.; Peters, J.; Baldwin, A.

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Institute of Electrical and Electronics Engineers -IEEE-:
20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII, TRANSDUCERS & EUROSENSORS 2019 : 23-27 June 2019, Berlin, Germany
Piscataway, NJ: IEEE, 2019
ISBN: 978-1-5386-8104-6
ISBN: 978-1-5386-8105-3
ISBN: 978-1-7281-2007-2
pp.1136-1139
International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) <20, 2019, Berlin>
European Conference on Solid-State Transducers (Eurosensors) <33, 2019, Berlin>
English
Conference Paper
Fraunhofer IISB ()
Fraunhofer IIS ()
3D-System Integration; heterogeneous integration; multi-sensor device; multifunctional nanomaterials; smart sensor system

Abstract
This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.

: http://publica.fraunhofer.de/documents/N-572559.html