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Wafer Level Packaging and System Integration

: Wolf, M. Jürgen; Ehrmann, Oswin

trias Consult, Berlin:
Microsystems Technology in Germany 2016 : Mikrosystemtechnik in Deutschland 2016
Berlin: Trias Consult, 2016
Book Article
Fraunhofer IZM ()

Microelectronic packaging and system integration is of main relevance for new application areas e. g. Cyber Physical Systems (CPS), Internet of Things (IoT), Ambient Assisted Living (AAL) as well as information & communication, logistics, security, automotive, health care and industrial electronics (Industry 4.0). Heterogeneous integration approaches following “More than Moore” are of high importance to address the needs of time to market and cost targets for future products. System in Packages (SiPs) are driving today‘s packaging and heterogeneous system integration technologies. New technologies are emerging which specifically meet the requirements of the new product generations in a wireless connected world regarding e.g. miniaturization, high speed wireless data transmission, power delivery & management or multi-device integration. In this context, individual and different wafer level packaging and 3D system integration approaches are adapted to specific application scenarios.