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Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications

: Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter

VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
MikroSystemTechnik Kongress 2019 : Mikroelektronik - MEMS-MOEMS - Systemintegration - Säulen der Digitalisierung und künstlichen Intelligenz, 28. - 30. Oktober 2019, Berlin
Berlin: VDE-Verlag, 2019
ISBN: 978-3-8007-5090-0
ISBN: 978-3-8007-5129-7
MikroSystemTechnik Kongress <2019, Berlin>
Conference Paper
Fraunhofer IZM ()

For harsh environment sensors, especially high-temperature sensors are a great demand worldwide. The field of active sensor technology is already well developed thanks to established microsystem technologies. A core challenge, however, often still exists in the field of interconnection technology (ICT). Only a few systems are available on the market that can withstand temperatures of up to 500 °C and guarantee reliable signal transmission. In this paper, a new technology approach is analysed in order to flexibly implement reliable and cost-effective ICT for high-temperature sensors.