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Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

: Bickel, Jan; Ngo, Ha-Duong; Schneider Ramelow, Martin; Lang, Klaus-Dieter


Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
22nd European Microelectronics and Packaging Conference & Exhibition, EMPC 2019. Technical papers : 16-19 September 2019, Pisa, Italy
Piscataway, NJ: IEEE, 2019
ISBN: 978-1-7281-6291-1
ISBN: 978-0-9568086-6-0 (Originalausgabe)
ISBN: 978-0-9568086-5-3 (Originalausgabe)
European Microelectronics and Packaging Conference & Exhibition (EMPC) <22, 2019, Pisa>
Conference Paper
Fraunhofer IZM ()

Three-dimensional printing and rapid prototyping are becoming more and more important in the field of research and low volume production. There are many systems that can print a wide variety of materials. In the field of thinfilm technology, as required for MEMS applications, only a few approaches are available. One of the promising technologies in this field is sputtering at atmospheric pressure with miniaturized plasma sources. This paper introduces a new anode nozzle geometry that increases the productivity of this novel technology substantial. It shows that three-dimensional thin-film metal structures can be printed more economically.