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Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
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2018
Conference Paper
Titel
Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
Author(s)
Zoschke, Kai
Eichhammer, Y.
Oppermann, H.
Manier, C.-A.
Dijk, M. van
Weber, C.
Hutter, M
Hauptwerk
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings
Konferenz
Electronics System-Integration Technology Conference (ESTC) 2018
DOI
10.1109/ESTC.2018.8546361
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM