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3D Technology – a promising Approach in the Field of Smart System Integration

: Wolf, M. Jürgen; Lang, Klaus-Dieter

Michel, B. (Hrsg.); Gessner, T.:
Smart systems integration for micro- and nanotechnologies : Honorary volume on the occasion of Thomas Gessner's 60th birthday
Dresden: ddp Goldenbogen, 2014
ISBN: 978-3-932434-78-5
Book Article
Fraunhofer IZM ()

System in Packages (SiPs) are driving today‘s packaging and heterogeneous sys-tem integration technologies (Figure 1). Besides already established approaches, new approaches are emerging which are specifically aligned to the needs of future smart products. Considering different application areas (Figure 2) e.g. Information & Communication, Security, Healthcare, Mobility & Transportation and Industrial Electronics. very specialized solutions are required to fulfill the technical needs and also to allow a cost effective high volume manufacturing. Traditional packaging solutions are not able anymore to deal with the required system specifications related to e.g. miniaturization, high speed data transmission, power delivery & management or multi-device integration as stated in the ITRS roadmap [1]. 3D-SiP is one of the most promising approaches to meet these technical requirements