English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Details
Full
Export
Statistics
Options
2017
Journal Article
Titel
The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Author(s)
Ramm, Peter
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Poupon, Gilles
CEA Leti
Couderc, Pascal
3D PLUS
Leitgeb, Markus
AT&S
Taklo, Maaike M.V.
SINTEF
Zeitschrift
Advancing microelectronics
Language
English
google-scholar
View Details
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Tags
device packaging
3D integration
wafer-level packaging
sensors