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  4. Where is the Sweet Spot for Panel Level Packaging?
 
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2019
Conference Paper
Title

Where is the Sweet Spot for Panel Level Packaging?

Abstract
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package approaches also larger rectangular substrates formats are targeted.
Author(s)
Braun, T.
Becker, K.F.
Hölck, O.
Voges, S.
Wöhrmann, M.
Böttcher, L.
Töpper, M.
Stobbe, L.
Aschenbrenner, R.
Schneider-Ramelow, M.
Lang, K.D.
Mainwork
6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Proceedings  
Conference
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 2019  
DOI
10.23919/LTB-3D.2019.8735124
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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