2019
Presentation
Title

Future Packaging Technologies in Power Electronic Modules

Title Supplement
Presentation held at 31st Annual Electronics Packaging Symposium, Binghampton, New York, September 5-6, 2019
Author(s)
Bayer, Christoph Friedrich  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
File(s)
Rights
Use according to copyright law
DOI
Language
English