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Characterization of electroplated leadfree bumps

 
: Wolf, M.J.; Jang, S.-Y.; Ehrmann, O.; Reichl, H.; Paik, K.-W.

Micromaterials and nanomaterials 3 (2004), pp.234-245
ISSN: 1619-2486
English
Journal Article
Fraunhofer IZM ()

Abstract
Pb-free solder is one of the biggest issues in today's electronic packaging industry. This paper introduces a developed Sn/3.5Ag alloy plating process for wafer level bumping. The effects of Under Bump Metallization (UBM) on the process, interfacial reaction have been investigated. Four different types of sputtering-based UBM layers - TiW/Cu/electroplated Cu, Cr/CrCu/Cu, NiV/Cu, and TiW/NiV - were fabricated with eutectic Pb/63Sn and Sn/3.5Ag solder using alloy plating.

: http://publica.fraunhofer.de/documents/N-55757.html